Light-intensity technology co Ltd  Inventory List  

Semiconductor Wafer Process                    

 

Model: ESI 9830 HDE

·                     Minimum Spot Size (1/e2): 1.5µm

·                     Accuracy: .15µm

·                     Wavelength: 1.0µm – LightWave

·                     Laser rep rate: 100kHz

·                     Maximum cut velocity: 400mm/second

·                     Wafer Diameter 200mm / 300mm.

 

Model: ESI 9830 HD

·                     Minimum Spot Size (1/e2): 1.5µm

·                     Accuracy: .15µm

·                     Wavelength: 1.0µm – LightWave

·                     Laser rep rate: 100kHz

·                     Maximum cut velocity: 200mm/second

·                     Wafer Diameter 200mm / 300mm.

 

Model: ESI 9830

·                     Minimum Spot Size (1/e2): 1.5µm

·                     Accuracy: .15µm

·                     Wavelength: 1.3µm – LightWave

·                     Laser rep rate: 50kHz

·                     Maximum cut velocity: 200mm/second

·                     Wafer Diameter 200mm / 300mm.

 

Model: ESI 9820(S)

·                     Minimum Spot Size (1/e2): 2.0µm

·                     Accuracy: .20µm

·                     Wavelength: 1.3µm – LightWave

·                     Laser rep rate: 30kHz

·                     Maximum cut velocity: 200mm/second

·                     Wafer Diameter 200mm / 300mm.(S-type for 150mm)

 

Model: ESI 9825

·                     Minimum Spot Size (1/e2): 1.6µm

·                     Accuracy: .16µm

·                     Wavelength: 1.0µm – Spectra-physics

·                     Laser rep rate: 70kHz

·                     Maximum cut velocity: 200mm/second

·                     Wafer Diameter 200mm / 300mm.

Model: ESI 9300

·                     Minimum Spot Size (1/e2): 3.5µm

·                     Accuracy: .35µm

·                     Wavelength: 1.3µm--LightWave

·                     Laser rep rate: 6kHz

·                     Maximum cut velocity: 100mm/second

·                     Wafer Diameter 200mm / 150mm/125mm/100mm

Model: GSI M435

·                     Minimum Spot Size (1/e2): 1.5µm

·                     Accuracy: .25µm

·                     Wavelength: 1.0µm –IPG , Spectra-physics

·                     Laser rep rate: 35kHz

·                     Maximum cut velocity: 200mm/second

·                     Wafer Diameter 150mm/200mm / 300mm.

Model: GSI M450

·                     Minimum Spot Size (1/e2): 1.5µm

·                     Accuracy: .20µm

·                     Wavelength: 1.0µm – IPG, Spectra-physics

·                     Laser rep rate: 50kHz

·                     Maximum cut velocity: 200mm/second

·                     Wafer Diameter 150mm/200mm / 300mm.

Model: GSI M450T

·                     Minimum Spot Size (1/e2): 1.5µm

·                     Accuracy: .15µm

·                     Wavelength: 1.0µm – IPG , Spectra-physics

·                     Laser rep rate: 70kHz

·                     Maximum cut velocity: 200mm/second

·                     Wafer Diameter 150mm/200mm / 300mm.

Model: GSI M550

·                     Minimum Spot Size (1/e2): 1.5µm

·                     Accuracy: .15µm

·                     Wavelength: 1.0µm –IPG , Spectra-physics

·                     Laser rep rate: 70kHz

·                     Maximum cut velocity: 200mm/second

·                     Wafer Diameter150mm/ 200mm / 300mm.